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Taiwan Semiconductor Manufacturing Company (TSMC) has announced that its chips manufactured on 3nm fabrication process will be coming in 2023, and the ones made with 2nm process will debut in 2025. At the TSMC 2022 Technology Symposium, the chipmaker also announced a new technology, FinFlex, that it will use to make the N3 and N3E chipsets. The technology is said to provide manufacturers the versatility to offer high performance, lower power…
